[802SEC] SLR PatCom Guide and LoA Form - now available
FYI new Patent Committee documents are now available.
--Paul
----- Original Message -----
From: <d.ringle@ieee.org>
To: <stds-board-comm@ieee.org>; <std-liaison-reps@ieee.org>;
<stds-wg-chairs@ieee.org>; <standards-staff@ieee.org>
Sent: Monday, December 17, 2001 2:38 PM
Subject: SLR PatCom Guide and LoA Form - now available
>
> All,
>
> There are some new Patent Committee documents available for your use.
>
> 1. Patent Letter of Assurance (LoA) Form
>
> This form can be found at http://standards.ieee.org/board/pat/index.html.
> Click on the link on the right-hand side for Entire Package
> (http://standards.ieee.org/board/pat/july_2001.zip). In the package,
there
> is an LoA form.
>
> This LoA form is the preferred format for letters of assurance. All
> responses received on the Form can be easily reviewed (and accepted) by
> PatCom. As of 1 January 2002, it is required that this be the only form
> sent to potential patent holders when seeking a letter of assurance.
>
> {If the patent holder does not complete the form and, instead, sends in a
> free-form letter, PatCom will take appropriate actions.}
>
> 2. PatCom Guide - "Understanding Patent Issues During IEEE Standards
> Development"
>
> This guide can be found at http://standards.ieee.org/board/pat/index.html.
> Click on the link for 'Understanding Patent Issues During IEEE Standards
> Development' (http://standards.ieee.org/board/pat/guide.html).
>
>
> If you have any questions, let me know.
>
> Regards,
>
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>
> David L. Ringle
> PatCom Administrator
> IEEE Standards Activities Dept.
>
> 445 Hoes Lane PH: +1 732 562 3806
> PO Box 1331 FX: +1 732 562
1571
> Piscataway, NJ 08855-1331 d.ringle@ieee.org
>
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>
>
>